Solder Paste AP-10 has been designed as a no clean, air or nitrogen reflowable solder paste. This formula has a wider process window and shows better activity on OSP boards
than previous no clean formulations. AP-10 is a solder paste that maintains its activity and printing characteristics for up to 8 hours without shear thinning. AP-10 can tolerate printing
pauses of up to 60 minutes with an effective first print down to 0.5 mm. The residues from AP-10 are light amber and clear from solder balls. AP-10 flux residues are light amber and
washable with alcohols and/or commercial cleaners.
Features:
Lead Free Applications
Very good wetting behaviour on most surfaces
High printing speeds up to 120 mm/sec
High activity on all substrates
Very long stencil life of more than 6 hours
Suitable for BGA and µBGA
Very good tack time for up to 24 hours
J-STD-004 Flux classification: ROL1
Very good printing characteristics down to 0,5 mm pitch with type 3 powder
Very good slump characteristics