Solder Paste no clean Sn96.5/Ag3.0/Cu0.5

SMD291SNL15T4 - ChipQuik Solder Paste no clean Sn96.5/Ag3.0/Cu0.5 Two Part Mix 15g (T4)

Description
Solder Paste No-Clean Lead-Free SAC305 T4 mesh 15g Two Part Mix.

Alloy: Sn96.5/Ag3.0/Cu0.5
Flux Type: Synthetic No-Clean
Flux Classification: REL0
Metal Content: 87% metal by weight.
Particle Size: T4 (20-38 microns)
Melting Point: 217-220C (423-428F)
Size: 15g Two Part Mix

Shelf Life
Before Mixed: Refrigerated >24 months, unrefrigerated >24 months
After Mixed: Refrigerated >6 months, unrefrigerated >2 months

Stencil Life
>8 hours @ 20-50% RH 22-28C (72-82F)
>4 hours @ 50-70% RH 22-28C (72-82F)

Stencil Cleaning
Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA).

Storage and Handling
Before Mixed: Store refrigerated or at room temperature 3-25C (37-77F). Do not freeze.
After Mixed: Refrigerate at 3-8C (37-46F). Do not freeze. Allow 4 hours for solder paste to reach an operating temperature of 20-25C (68-77F) before use.

Once mixed, the solder paste can be dispensed by cutting a small corner off the bag. It can be resealed with a piece of tape, or it can be stored by dispensing the entire bag into the provided empty jar.

Transportation
This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will not impact this product's stated shelf life.